Intel and Nokia are joining forces to develop a next generation mobile computing device.

Intel said it expects consumers will be looking towards future mobile devices so they can enjoy a rich web experience, at any time and in any place.

The collaboration between the two companies will see them work together to create chips for next-generation mobile broadband gadgets running open-source software, they said. Intel also revealed it is licensing Nokia's HSP A/3G modem, for use in the products.

When pushed on what form factor future the products will take, both companies declined to comment. There was also no information on when the devices will become available.

"This Intel and Nokia collaboration unites and focuses many of the brightest computing and communications minds in the world, and will ultimately deliver open and standards-based technologies, which history shows drive rapid innovation, adoption and consumer choice," said Anand Chandrasekher, Intel senior vice president and general manager, Ultra Mobility Group.

"We will explore new ideas in designs, materials and displays that will go far beyond devices and services on the market today. This collaboration will be compelling not only for our companies, but also for our industries, our partners and, of course, for consumers," said Kai Öistämö, executive vice president, Devices, Nokia.