NEC Electronics is working on a new memory technology which could enable PCs to ship with 10GB of RAM without the need to add extra slots.
NEC Electronics, Elpida Memory and Oki Electric have developed a highly compact memory die stacking approach where a 450 micrometer-high stack can contain 8 memory chips and one controller chip leading to a 1 terabit capacity stack.
Each memory chip has more than 1,000 connectors on the top and bottom surfaces with polysilicon electrode connectors running right through the chip. Each chip is connected to the next by myriad "microbumps" placed 50 micrometers apart. The individual chips are extremely thin, at just 50 micrometers thick.
This compactness means cell phones and other portable devices will have enough RAM to run high-definition video and other 3D graphics applications. It also means that PCs could look forward to having 10GB or more of RAM in the future.
See our sister title Techworld for more details.