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Intel unveils 'Menlow' ultraportable PC

Post-McCaslin mobile internet PC at Computex

Only a couple of months after Intel unveiled its McCaslin chips for ultramobile computers, Intel has rolled out a prototype device running McCaslin's successor, Menlow.

Intel's Anand Chandrasekher today showed a prototype from Elektrobit at Computex. Based on Menlow, the Elektrobit Intel Mimd (mobile internet multimedia device) won't ship until next year.

During Chandrasekher's speech he also showed Compal's prototype Menlow device.

The Elektrobit Mimd prototype has a slide-out keyboard, a 4.8in 1,024x600-pixel touchscreen and a 3.2Mp camera. Instead of Windows, the Mimd uses Midinux, a Red Flag Linux operating system for mobile devices.

The Mimd is lightweight but felt hot when picked up. Intel executives said power-management features in the software had not been activated in the prototype and production models will run much cooler.

The Mimd will include Wi-Fi and Bluetooth, with the choice of adding Mobile WiMax or HSPA (High Speed Packet Acces) cellular access. Other features include integrated GPS (Global Positioning System), navigation software, a Micro USB port and a slot for a Micro SD (Secure Digital) memory card.

Like the Elektrobit prototype, the Compal device has a slide-out keyboard and touchscreen. It was also shown running Midinux.

See also: Via unleashes ultraportable PC

Neither Compal or Elektrobit plan to sell these devices under their own names. Elektrobit hopes to license its design to interested companies, while Compal will manufacture its device under contract for another company.

When Menlow-powered ultraportables like these become available next year, Intel expects them to have a battery life of up to six hours, nearly double the three hours of battery life typical of devices based on McCaslin.

The McCaslin package - formerly known as the Ultra Mobile Platform 2007 - consists of Intel's A100 or A110 processors and a chipset. These processors, formerly codenamed Steeley, are basically Celeron-M chips that Intel put into a smaller package designed for ultraportable devices.


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